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Laboratory Substrate Bonders

www.suss.com

 
Suss MicroTec supplies Mask Aligners, Spray Coaters, Spin Coaters, Substrate Bonders, Flip Chip Bonders and Substrate Probers with a focus on both research  and university work as well as the semi-conductor industry.

With over 50 years experience and sales and service centres worldwide, Suss is the no.1 choice for specialized, innovative equipment to meet the demands of cutting edge research and production. 

Download Suss SB8e & SB6e Brochure

SUBSTRATE BONDER Suss SB8e (up to 8") or Suss SB6e (up to 6") or Suss CB6e (up to 6")

bulletfeedback controlled independant top and bottom plate heating (max temp 550ºC)
bulletuniversal bond head capable of anodic, eutectic, thermal compression, glass fritt bonding and fusion bonding
bulletpc controlled process recipe and data collection (exportable to excel)
bulletanodic bonding voltages up to ±2000V
bulletbond head force controllable and repeatable
bulletcontrollable chamber pressure (down to 10¯ bar) with turbo pump (optional)
bulletControllable chamber overpressure (optional)
bullettriple stack bonding (option)
bullethot embossing (option)

Key Benefits

bulletup to 1u postbond accuracy (under control conditions with laser prebond)
bulletup to 3u postbond accuracy (under controlled conditions)
bullettemp uniformity of <1%
bulletSuss tool is scalable to fully automatic production tool

For more information contact us at sales@coltronics.com.au

 

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Last modified: 06/05/09