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Production Substrate Bonders

www.suss.com

Suss MicroTec supplies Mask Aligners, Spray Coaters, Spin Coaters, Substrate Bonders, Flip Chip Bonders and Substrate Probers with a focus on both research and university work as well as the semi-conductor industry.

With over 50 years experience and sales and service centres worldwide, Suss is the no.1 choice for specialized, innovative equipment to meet the demands of cutting edge research and production. 

SUBSTRATE BONDER Suss ABS200 (up to 8")

bulletfully automated wafer preparation, alignment and bonding
bulletmodular design allows many possible configurations
bulletmegasonic cleaning module (optional)
bulletplasma wafer preparation module (optional)
bulletup to 5 bonding chambers possible
bulletup to 9 cassette stations possible
bulletpattern recognition better than 0.1um
bulletlaser prebond available (option) for best postbond alignment accuracy
bulletfeedback controlled independant top and bottom plate heating (max temp 550ºC)
bulletuniversal bond head capable of anodic, eutectic, thermal compression, glass fritt bonding and fusion bonding
bulletpc controlled process recipe and data collection (exportable to excel)
bulletanodic bonding voltages up to ±2000V
bulletbond head force controllable and repeatable
bulletcontrollable chamber pressure (down to 10¯ bar) with turbo pump (optional)
bulletControllable chamber overpressure (optional)
bullettriple stack bonding (option)
bullethot embossing (option)

Key Benefits

bulletup to 1u postbond accuracy (under control conditions with laser prebond)
bulletup to 3u postbond accuracy (under controlled conditions)
bullettemp uniformity of <1%

For more information contact us at sales@coltronics.com.au

 

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Last modified: 06/05/09