Australia Wide Supply of Production Equipment and Consumables to Electronics and Semi-conductor Industry and Research
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Australia Wide Supply of Production Equipment and Consumables to Electronics and Semi-conductor Industry and Research |
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Flip Chip Bonders / Nano-imprint Tools Smart Equipment Technology (France) is a supplier of "state of the art" flip chip bonders and nano-imprint tools with industry leading tools for pre and post bond alignment accuracy.
Production Flip Chip Bonder - The FC150/200/300 Device Bonders are industry standards for accurate placement and bonding of various types of devices on a wide varietry of substrates. They are used extensively in the IR-FPA, Optoelectronics, 3D MEMS and RF industries..
For more information contact us at sales@coltronics.com.au
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