Australia Wide Supply of Production Equipment and Consumables to Electronics and Semi-conductor Industry and Research
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Australia Wide Supply of Production Equipment and Consumables to Electronics and Semi-conductor Industry and Research |
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Wafer Dice Bonders Westbond (USA) has over 40 years experience supplying wire bonding and die attach, wire pull and shear test equipment for the microelectronics equipment industry.
Manual Die Bonders 72 and 73 Series - Single/Triple Head Epoxy/Eutexctic/Beam Lead Bonders Manual Wire Bonders 73 and 74 Series - Ultrasonic Wedge/Ball Bonders Semi-Automatic Wire Bonders 45, 47, 54 and 57 Series - Semi-Automatic Ultrasonic Wedge/Ball Bonders Automatic Wire Bonders 24, 27, 34, 35 and 37 Series - Automatic Ultrasonic Wedge/Ball Bonders Pull Test Machines
For more information contact us at sales@coltronics.com.au |
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Send mail to
admin@coltronics.com.au with
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