SET -Smart Equipment Technology

"Solution provider for High Accuracy Manual, Semi-Automatic and Automatic Flip Chip Bonders"

SET- Smart Equipment Technology is an industry leader in providing high accuracy die to die and die to wafer bonding.

SET equipment is tailored to providing accurate solutions to 3D interconnect, IR sensors & FPA, RF, Optoelectronics & Photonics, MEMS packaging and MCM & LCD production and research challenges.

SET also supplies step and print UV-NIL and Hot Embossing Lithography tools.

Our Products

- KADETT High Precision Die Bonder for Laboratory

- FC150 Semi-automatic Die / Flip Chip Bonder up to 6"

- FC300 Semi-automatic Die / Flip Chip Bonder up to 12"

- NPS300 Step and Print UV Nanoimprinter up to 12"

Applicable Industries

  • University Electronics, Material Science, Renewable Energy Groups
  • Contract PCB manufacturers and Electronic Repair and Rework Providers
  • Solar Industry Research and Development Departments